Daniel J. Kuzma
Barnesville
Summary
Failure analysis specialist with proven expertise in root cause investigation, identifying and resolving complex failure modes for continuous improvement . Adept at leveraging analytical skills and technical knowledge to drive solutions and improve product reliability. Strong collaborator who adapts quickly to changing needs and ensures team success. Known for precision, problem-solving abilities, and effective communication.
Overview
28
28
years of professional experience
Work History
Failure Analysis Engineer 2
Nokia
09.2010 - Current
- Manage team of module FMA techs to diagnose and repair optical transceivers including setting priority, managing SAP inventory, work instructions, FMA tracking
- Lead technical failure analysis effort to reduce failure backlog 82% in 2 years timeframe, reducing on the books inventory cost
- Proficient in JMP statistical analysis software for failure tracking, custom database queries, test data analysis
- Diagnose root cause and author failure analysis reports of customer field returns across four generations of coherent optical line cards/modules
- Create/maintain yield and failure tracking Microsoft PPT slide decks for management process improvement/operations reviews
Engineering Technician
Tyco Electronics
07.2009 - 09.2010
- Perform FMA of all QSFP active cable assemblies during development and manufacturing phase of product
- Increased FT yield by 10% over 4 months by implementing process changes based on FMA data
- Maintain and perform calibration/PM of all production test equipment and fixtures
- Document development procedures for manufacturing, create yield reports, support all production equipment
Process Engineer
CyOptics, Inc. formerly Apogee Photonics
09.2001 - 11.2008
- Process owner for all laser welding of fiber optic assemblies, yield, JMP statistical process control, and documentation
- Transferred and installed LIM production line from PA to Mexico to reduce labor costs and eventually increasing yields by 4%
- Experienced on all operations including chip mount, wire/ribbon bonding, laser welding, and seam seal/leak check
- Developed alignment algorithms using Microsoft Visual Basic 6 for automated alignments to reduce laser welding cycle time 33%
- Provided failure analysis and corrective action on high flyer failure modes throughout manufacturing process
Electronics/Photonics Processor
Agere Systems/Lucent Technologies
11.1999 - 09.2001
- Operation of multi-axis laser welding equipment for fiber attach
- Aligning of fiber optic modulators including stripping, cleaving, connectorization, polishing, inspection, and testing
- Creation of defect tracking forms that utilizes Pareto Charts to monitor defect levels at key operations throughout the process
- Aided in the implementation of fiber optic interconnect jumpers that can be replaced at low cost with substantial savings to the company
Process Engineer
FCI Electronics
09.1997 - 11.1999
- Technical group leader of test technician team for fabrication and preventative maintenance of all test fixturing interfaces for telecommunications cable assembly manufacturing
- Development of Direct Attach Wire Welding process for IBM, including creating all process instructions/documentation
- Designed bar code packaging system for multiple part number kit assemblies increasing yield to 100% at post pack
- Aided in implementation of palletized transport of cables to welding operation with conveyors, increasing production 200%
- Team leader during implementation of Lean Manufacturing on IBM TBS high speed cable assembly manufacturing line
Education
Introduction & Intermediate Auto Cad R13
Pennsylvania State University
Wilkes-Barre, PaAssociates Degree - Electronics Technology
Lincoln Technical Institute
Allentown, PaDiploma - College Preparatory
Mahanoy Area High School
Mahanoy City, PaSkills
- Quality management systems
- Technical report writing
- Statistical data analysis
- Attention to detail
- Multitasking Abilities
- Root-cause analysis
- Problem-solving abilities
- Process development
Timeline
Failure Analysis Engineer 2
Nokia
09.2010 - Current
Engineering Technician
Tyco Electronics
07.2009 - 09.2010
Process Engineer
CyOptics, Inc. formerly Apogee Photonics
09.2001 - 11.2008
Electronics/Photonics Processor
Agere Systems/Lucent Technologies
11.1999 - 09.2001
Process Engineer
FCI Electronics
09.1997 - 11.1999
Associates Degree - Electronics Technology
Lincoln Technical Institute
Diploma - College Preparatory
Mahanoy Area High School
Introduction & Intermediate Auto Cad R13
Pennsylvania State University
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